Biren Technology Said to Weigh USD 1 Billion Share Placement

Biren Technology is considering raising about USD 1 billion, equivalent to roughly HKD 7.8 billion, through a share placement to support its artificial intelligence development plans. Banks are at an early stage and are sounding out potential investor interest. Biren Technology develops graphics processing units (GPUs) used to train and run artificial intelligence models.

The company listed in Hong Kong on January 2, 2026 at an offer price of HKD 19.6 per share. The listing raised net proceeds of HKD 5.375 billion, earmarked for future research and development of intelligent computing solutions, as well as the commercialization of intelligent computing solutions and working capital.

In July 2026, shortly after its listing lock-up period expired, Biren Technology placed shares with the market, involving a total of 153 million new H shares at HKD 46.2 each, raising HKD 7.069 billion. The proceeds were intended to accelerate the commercialization and production of next-generation products, strengthen research and development of cutting-edge technology projects, and fund strategic investments and acquisitions. The company agreed at the time not to sell any shares for 90 days, a period due to expire in early October.