Broadcom Seeks Over $60 Billion in AI Debt Deal; Blackstone, Apollo in Chip Financing Talks

Broadcom is in talks with Blackstone and Apollo Global Management to raise more than $60 billion in debt financing through a special purpose vehicle (SPV) to support AI chip infrastructure. The beneficiaries of the financing include Anthropic and other companies, with the aim of providing computing power for AI model training and inference. The three parties established the AI XPV Cooperation framework in June 2026, and this proposed transaction is a follow-up financing arrangement under that framework.

Broadcom will provide guarantees for part of the senior secured tranche.

Previously, the three parties completed a $35 billion debt agreement under the AI XPV Cooperation framework, and the proposed transaction follows a similar model. If the financing is completed successfully, it will help Anthropic and other participants obtain chips and key AI infrastructure, while expanding Broadcom's sales in the chip and data center equipment sectors.