Dinglong Starts Qianjiang Phase II High-End Photoresist Line, Total Capacity 330 Tons

China's first fully self-developed photoresist production line has officially commenced operations. Dinglong Co. disclosed its product layout and latest progress in the semiconductor materials sector during a recent institutional research visit, covering four segments: wafer photoresist, CMP supporting materials, advanced packaging materials, and display materials.

In wafer photoresist, the company's Qianjiang Phase II KrF/ArF high-end photoresist mass production line has officially started production, with an annual capacity of 300 tons. Combined with Phase I, total capacity has risen to 330 tons. The line achieves independent production of core raw materials such as resin, with fully self-controlled formulations and processes. To date, Dinglong has developed over 40 high-end wafer photoresists, with nearly 30 undergoing simultaneous customer verification. Among these, eight ArF and KrF products have received batch purchase orders from multiple mainstream wafer fabs. The company is also deploying supporting materials such as BARC (bottom anti-reflective coating) and SOC (spin-on carbon), building a complete self-owned supply chain.

In CMP supporting materials, polishing pads have achieved mass production. Several specialized polishing slurries for copper barrier layers, large wafers, silicon carbide substrates, and TSV processes have passed full-process verification at leading wafer fabs and secured batch orders. The Xiantao polishing slurry industrial park production line is progressing steadily, with abrasive particles now self-supplied, further strengthening the integrated CMP material supply capability. Research and development of next-generation polishing pads for glass substrates and ultra-large-size applications, along with customer sampling, are proceeding in an orderly manner. The Qianjiang Phase III polishing pad production line has commenced construction.

In advanced packaging materials, the company has deployed seven packaging PI (polyimide) products, with two receiving orders from multiple customers. For temporary bonding adhesive, on the basis of stable large-scale shipments to existing customers, the company continues to deepen market expansion and promote multi-scenario applications.

In display materials, products such as PSPI (photosensitive polyimide) and TFE encapsulation ink have achieved batch supply to G8.6 high-generation production lines. The YPI production line has completed an upgrade trial run and is cooperating with panel manufacturers for process certification of new projects.