DR Laser Says TGV Equipment Covers Wafer and Panel Applications; Glass Substrate Draws Repeat Orders

DR Laser said at an institutional phone conference on August 19 that its TGV-related applications currently mainly cover advanced packaging glass substrate through-holes, FAU and optical communication glass passive devices. Glass substrates offer advantages in surface flatness, thermal expansion matching and high-frequency signal transmission. The company's TGV equipment has covered both wafer-level and panel-level applications, and it continues to cooperate with customers of different types across various regions. The glass substrate segment has already seen repeat purchase demand from customers.

TGV and its derivative applications remain in the industry introduction phase, with high customer attention and market activity.