Intel and Lens Technology Partner to Explore Glass Substrate Packaging Solutions
Intel Corporation has entered into a partnership with Lens Technology to jointly research and develop packaging solutions based on glass substrates. The collaboration aims to explore the potential of glass as a substrate material for advanced semiconductor packaging, which could offer benefits in performance and thermal management. No financial terms or timeline were disclosed.
Intel Corporation and Lens Technology have formed a partnership to jointly explore packaging solutions based on glass substrates. The collaboration will focus on researching the use of glass as a substrate material for advanced semiconductor packaging, potentially enabling improvements in performance and thermal management. No further details on the scope or duration of the partnership were provided.
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