Sony and TSMC Plan 1 Trillion Yen Chip Joint Venture in Kumamoto by 2029
Sony and TSMC will set up a joint venture with an investment of about 1 trillion yen (about HK$49.58 billion), targeting production of next-generation image sensor chips at a new Kumamoto plant as early as 2029. Sony will hold 60% and TSMC 40%, with the company due to be established by the end of March 2027. The sensors will serve smartphones and autonomous driving. TSMC disclosed in May 2026 a non-binding memorandum of understanding with Sony Semiconductor Solutions covering strategic cooperation on research, development and manufacturing.
Sony and TSMC will establish a joint venture with a planned investment of about 1 trillion yen (about HK$49.58 billion), building a plant in Kumamoto Prefecture, Japan to produce next-generation image sensor chips as early as 2029. Sony will hold a 60% stake in the joint venture and TSMC 40%, with the company to be set up by the end of March 2027.
The image sensors will be used in smartphones, autonomous driving and other applications. In May 2026, TSMC disclosed that it had signed a non-binding memorandum of understanding with Sony Semiconductor Solutions to build a strategic partnership for the research, development and manufacturing of next-generation image sensors, including plans to establish a joint venture and construct research, development and production lines at a new facility in Koshi City, Kumamoto Prefecture.
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