Sony and TSMC Sign Contract for 747 Billion Yen Image Sensor Plant in Kumamoto, Production by 2029
Sony Group's semiconductor subsidiary and TSMC have signed a definitive contract to form a joint venture in Kumamoto Prefecture, Japan, to produce next-generation image sensors. The venture, with a total investment of about 747 billion yen, will be 62% owned by Sony and 38% by TSMC, and will become a consolidated subsidiary of Sony. Production is slated to begin in 2029. The new plant will be located in Koshi, with Sony's existing facility transferred to the venture. The companies aim to meet growing AI-related demand, building on their existing JASM partnership. The venture is expected to be established within fiscal 2026.
Sony Group's semiconductor subsidiary and TSMC announced on August 11, 2026, that they will jointly produce next-generation image sensors in Kumamoto Prefecture, with production scheduled to begin in 2029. The joint venture will have a total investment of approximately 747 billion yen for the construction of core production facilities.
The companies have signed a legally binding definitive contract, with Sony holding 62% and TSMC 38% of the joint venture. The company will become a consolidated subsidiary of Sony Group, with Sony leading business operations and appointing the representative director. The new plant will be located in Koshi, Kumamoto Prefecture, and Sony's existing plant will be transferred to the joint venture to establish production lines and an R&D system.
Previously, TSMC, together with Sony, Denso, and Toyota, formed Japan Advanced Semiconductor Manufacturing (JASM), which began construction of a production base in Kumamoto Prefecture in April 2022. The first wafer fab started mass production at the end of 2024, and construction of a second wafer fab has begun. The new joint venture aligns with the existing semiconductor production layout and is aimed at expanding demand related to artificial intelligence. The joint venture is scheduled to be established within fiscal 2026 and will produce high-performance image sensors for smartphones and other devices in a later phase.
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