Xiaomi Unveils Xuanjie O3 Chip with CXMT LPDDR6 in Flagship Processor Debut
Xiaomi has released its new Xuanjie O3 chip, the first flagship mobile processor to support LPDDR6 memory, with domestic memory maker CXMT confirmed as the core LPDDR6 partner. CXMT sent LPDDR6 samples to key customers in March 2026, with verification nearing completion in early August, marking the first application of domestic low-power memory in a flagship processor. The LPDDR6 standard, published by JEDEC in July 2025, uses a 24-bit dual-channel architecture. CXMT's first LPDDR6 product offers a design rate of 12800 Mbps and a base rate of 10667 Mbps with the SoC, featuring 16Gb die capacity, 16GB chip capacity, and 1295 Ball POP packaging.
Xiaomi has released its new-generation Xuanjie O3 chip, which becomes the first flagship mobile processor to support LPDDR6 memory. Domestic memory maker ChangXin Memory Technologies (CXMT) has been confirmed as the core LPDDR6 memory partner for the Xuanjie O3. In March 2026, CXMT's LPDDR6 was sent to key customers as samples, and by early August the products were nearing the end of verification. With the Xuanjie O3 launch, domestic low-power memory products have been applied in a flagship processor for the first time.
The LPDDR6 product standard was published by JEDEC in July 2025, adopting a 24-bit dual-channel architecture, which improves data scheduling flexibility compared with the 16-bit channel of LPDDR5X. Previously, flagship launches of each new LPDDR standard generation were dominated by three overseas manufacturers - Samsung, SK Hynix and Micron. CXMT's LPDDR6 breakthrough marks progress for domestic chips in this field.
CXMT's first LPDDR6 product has a design rate of 12800 Mbps, with a base rate of 10667 Mbps when operating in tandem with the SoC. The die capacity is 16Gb and the chip capacity is 16GB, using 1295 Ball POP packaging. Compared with LPDDR5X products, it offers optimizations in low-power design and RAS features.
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