XMC Unveils Plan to Build 3D Link-Opto-SOI Industry Hub
XMC, a Chinese chipmaker, launched its 'Xin Guang Plan' to establish a leading specialty wafer manufacturing and 3D integration platform over the next decade. The company aims to quadruple production capacity, drive a supply chain ecosystem worth over RMB 100 billion, and cultivate more than 10,000 high-end semiconductor professionals.
XMC has unveiled its 'Xin Guang Plan', a strategic initiative for the next decade. Under the guiding principles of 'opto-electronic interconnection and 3D memory-computing integration', the company will build an internationally competitive specialty process wafer manufacturing and 3D integration platform, aiming to establish itself as the leading hub for '3D Link, opto-electronic fusion, and SOI' technology.
As part of the plan, XMC targets a fourfold increase in production capacity, fostering a collaborative upstream and downstream industrial ecosystem valued at over RMB 100 billion, and nurturing more than 10,000 high-end semiconductor professionals.