China Issues 15th Five-Year Plan for Electronic Information Manufacturing

On September 15, 2026, the Ministry of Industry and Information Technology and the National Development and Reform Commission issued the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.

The plan calls for consolidating the foundations of the photon industry and advancing breakthroughs in core photonic technologies. It supports the research, development, and iterative upgrading of simulation and design software such as photonic design automation and optoelectronic co-design automation. It calls for building common process platforms for micro-nano processing and manufacturing and optoelectronic integrated circuits, and for establishing research and innovation programs in photonic functional materials and process materials. It also calls for strengthening the supply of light generation, light processing, light sensing, integrated optical chips, and micro-nano optical components.

The plan further proposes research, development, and industrialization of optical transceiver modules and engines, optical processing modules, lidar and gyroscopes, and supporting electrical chips and devices. It calls for establishing pilot testing and verification platforms around key areas and common needs of the photon industry to advance result verification, process optimization, equipment selection, and technology integration, accelerating new product development and industrial application. It also seeks to promote the penetration of photonic technology into key areas including artificial intelligence, new communications, ubiquitous terminals, industrial manufacturing, healthcare, high-end manufacturing, and urban security.

The plan proposes promoting the high-end development of electronic components and electronic materials. It calls for coordinated development of the electronic components and electronic materials industries, and for accelerating the development of a batch of mature, reliable, and widely applicable off-the-shelf industrial foundation products to meet demand in key areas such as artificial intelligence, next-generation information and communications, aerospace, and next-generation intelligent terminals. It supports the development of circuit, connection, electromechanical, sensing, and functional material electronic components toward high frequency and high speed, high integration, and high reliability. It calls for breakthroughs in high-performance electronic functional materials, packaging and assembly materials, and process and auxiliary materials, and for improving the quality stability, reliability, and consistency of electronic components and electronic materials. The plan also proposes building upstream and downstream matching platforms around key manufacturing industry chains, supporting the construction of pilot testing platforms and application verification centers for electronic components and electronic materials, leveraging the matching role of the international trading center for electronic materials and the international trading center for electronic components and integrated circuits, developing the electronic distribution industry, and enhancing supply chain risk resilience.

The plan proposes advancing full-chain breakthroughs in integrated circuits. It calls for developing high-end chip products such as high-performance processors, high-density memory, and high-reliability analog and mixed-signal chips; improving integrated circuit manufacturing by refining mature process nodes and raising advanced process capabilities; promoting the development and application of advanced packaging and testing technologies; upgrading the wide-bandgap semiconductor industry; and advancing the industrialization of ultra-wide-bandgap semiconductors such as gallium oxide and diamond. The plan also calls for continuously improving the supply capacity of key equipment, materials, and components, accelerating the development of electronic design automation tools and intellectual property cores, and advancing breakthroughs and applications of technologies such as three-dimensional integration.