147 Companies Complete Private Placements in 2026, Raising RMB 447.248 Billion

Since the start of 2026, 147 companies have completed private placements, with 166 placement records in total, issuing 51.606 billion shares and raising RMB 447.248 billion. Based on the listing date of the placements, the board distribution shows 42 companies on the Shenzhen Main Board raising RMB 187.789 billion in total; 47 companies on the Shanghai Main Board raising RMB 148.803 billion; 34 companies on the ChiNext board raising RMB 35.768 billion; and 22 companies on the STAR Market raising RMB 72.520 billion.

By industry, the companies that completed placements in 2026 span 25 Shenwan industries. The industries with the most placements were electronics, machinery and equipment, and automobiles, with 24, 16, and 14 companies respectively. The industries with the largest fundraising amounts were electronics, coal, and nonferrous metals, raising RMB 89.021 billion, RMB 74.168 billion, and RMB 69.822 billion respectively. Six placements raised more than RMB 10 billion, eight raised between RMB 5 billion and RMB 10 billion, 22 raised between RMB 2 billion and RMB 5 billion, 30 raised between RMB 1 billion and RMB 2 billion, and 81 raised less than RMB 1 billion, of which 43 raised less than RMB 500 million. Among the companies that completed placements, Hongqiao Holdings raised the most at RMB 63.518 billion, followed by China Shenhua and Dientou Chanrong at RMB 60.080 billion and RMB 45.285 billion respectively. SMIC raised RMB 40.601 billion, Air China RMB 20.000 billion, Dientou Energy RMB 14.088 billion, and Hua Hong Semiconductor RMB 8.268 billion.

Among the placement records completed since the start of 2026, 98 records show the latest closing price at a premium to the placement price. The largest premiums were recorded by Kexiang Co. , Hua Hong Semiconductor, and Jingfeng Mingyuan, whose latest closing prices stood at premiums of 707.14%, 417.03%, and 307.69% respectively to their placement prices. Kexiang Co.' s placement listed on February 5, 2026, Hua Hong Semiconductor's on September 9, 2026, and Jingfeng Mingyuan's on March 18, 2026. A total of 67 records show the latest price at a discount to the placement price. The largest discounts were recorded by JAC Motors, BAIC BluePark, and Fanya Microperforation, whose latest closing prices stood at discounts of 61.81%, 40.87%, and 39.61% respectively to their placement prices. JAC Motors' placement listed on February 12, 2026, BAIC BluePark's on January 30, 2026, and Fanya Microperforation's on February 27, 2026.