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The Federal Reserve kept the federal funds rate steady at 3.50% to 3.75% after its July meeting, in a 9-to-3 vote. Three officials dissented, favouring a quarter-point increase. It was the first time in ten years that as many as three policymakers formally broke ranks on the rate direction, highlighting unusual internal division.
In the first half of 2026, semiconductor private-market funding reached RMB 162.7 billion across 912 deals, but AI surpassed it with RMB 181.2 billion across 885 deals, marking the first time since 2020 that semiconductor was not the largest sector. Chip design led with 358 deals, while Shanghai Xinsheng received RMB 11.448 billion for 300mm wafer capacity, representing 7% of the total. Corporate investors dominated, with SMIC Capital and others active, and Shanghai led regional funding.
NAURA has officially launched its third-generation 12-inch full quartz vertical silicon nitride LPCVD equipment, model SICRIUS SN302D II, for the global market. The system is designed for applications in memory, advanced logic, silicon photonic integration, and high-end sensors.
In December 2024, Country Garden sold its 1.56% stake in memory chip maker ChangXin Memory Technologies (CXMT) to a Hefei state-owned platform for RMB 2 billion. After CXMT’s IPO on the STAR Market on July 27, 2026, the stake was valued at over RMB 47 billion, approximately 24 times the sale price. The transaction provided immediate liquidity for Country Garden’s housing delivery obligations, while the state-owned buyer assumed long-term industry upside.
ChangXin Memory Technologies, China’s top DRAM maker, plans to list on the Shanghai Stock Exchange and raise up to approximately RMB66.6 billion, in what would be Asia’s largest IPO of 2026 and one of China’s biggest on record. Strong investor appetite pushed the offer price to about double the earlier guidance. The company reported first-quarter 2026 revenue of RMB50.8 billion, a year-on-year surge of more than 700%, while its global memory-chip market share reached 8%, up from 3% a year earlier. It swung to a profit of over $1 billion in 2025 from a near $3 billion loss in 2023, though it still trails leaders in advanced technology and faces export curbs.
Apple added a risk section on components and computing resources in its latest 10-Q filing, warning that supply shortages and price swings could hurt revenue. It said persistent memory chip shortages, particularly NAND Flash and DRAM, have hampered its ability to secure enough components and products on commercially reasonable terms. Apple also said its AI services depend on sufficient computing capacity and that, amid industry-wide tightness, it relies heavily on third-party infrastructure such as Google.
AMD has submitted its latest batch of RDNA 5 GPU IP patches to the Linux kernel, formally beginning support for the sixth-generation Display Core Next (DCN6) engine. DCN6 corresponds to the GFX13 architecture, the RDNA 5 GPU family. The patches introduce a scaling integrity and cost evaluation surface, a UPSP pre-scaling unit for 4:2:0 and 4:2:2 content, and new pixel format support. This marks DCN6's first appearance in kernel code. AMD has not disclosed a mass-production shipping timeline for RDNA 5.
Nvidia has signed a lease for Hut 8's Beacon Point campus in Texas, with a 1-gigawatt capacity and hundreds of thousands of its GPUs. The 15-year base lease is valued at $19.6 billion, with a potential 30-year total of $50.2 billion if all renewal options are exercised. Nvidia's credit default swap spread widened amid reports of large financing deals. The company's unpaid data center lease payments reached $32.4 billion in its latest quarter, up from $7.4 billion in the same period of 2025.
Changxin Technology (Changxin Memory) began trading on the A-share market on July 27, 2026, representing a significant breakthrough in China's DRAM sector. The listing breaks the long-standing monopoly of Samsung, SK Hynix, and Micron in the memory chip market, achieving a from-zero-to-one breakthrough for domestic DRAM. The company's development has been supported by national semiconductor policies, market demand for self-controlled memory chips, entrepreneurial efforts, long-term investment from Hefei state-owned industrial funds, and surging demand from AI computing infrastructure. The IPO provides stable, long-term funding for R&D, production expansion, and product upgrades, helping to narrow the technology gap with global leaders and secure China's semiconductor supply chain. However, Changxin faces severe challenges including technology gaps in advanced lithography, yield rates, and patent portfolios, as well as market cyclicality and pricing power of incumbents.
Huawei plans to mass-produce AI chips using glass substrate technology by 2027, partnering with domestic companies including BOE and Visionox and importing key materials from South Korea. The glass substrate offers advantages such as high flatness for dense 3D stacking, reduced warpage, lower power leakage, and higher data rates, helping Huawei compensate for limited access to EUV lithography. The company has captured about 60 percent of China's AI chip market, partly due to Nvidia's withdrawal amid geopolitical factors.