Intel Targets 6,000 Wafers a Month for 14A by End-2027 as 18A Yields Reach 80%
Intel is preparing its 14A process for volume production, targeting about 6,000 wafers a month by the end of 2027 while deploying equipment and running customer validation. The node follows 18A, which uses RibbonFET gate-all-around transistors and PowerVia backside power delivery and is running at yields near or at 80%. Intel is promoting its foundry business against TSMC and Samsung, and has said 14A will be among the first nodes to use High-NA EUV lithography.
Intel is advancing preparations for volume production of its 14A process. 14A is Intel's next core process node after 18A and forms part of its advanced foundry roadmap. Intel is carrying out capacity planning and equipment deployment for 14A and is progressing through related customer validation.
Capacity plans indicate that by the end of 2027, the 14A process will reach a production scale of about 6,000 wafers a month.
The 18A process introduces RibbonFET gate-all-around transistors and the PowerVia backside power delivery network. The node bears on the direction of future Core processors and is the foundation for Intel's efforts to win external foundry customers. 18A yields are currently near or at 80%. Intel is promoting its foundry business and competing with TSMC and Samsung.
Intel plans to use 18A to attract external customers and intends to extend its advanced process roadmap through 14A. Intel has said repeatedly that 14A will be one of the first important nodes to adopt High-NA EUV lithography. Intel has also set out a "five nodes in four years" plan to catch up in process technology. 14A remains some time away from full volume production, and TSMC and Samsung are also developing their own next-generation advanced processes.
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