MTC Showcases DFB, EML and PAM4 Optical Chips at CIOE 2026
On September 11, 2026, MTC exhibited multiple optical chip products at the 27th China International Optoelectronic Exposition (CIOE 2026), including a series of 25G-and-below DFB laser chips and a 1342nm EML+SOA for next-generation 50G PON products in access networks.
The company also displayed a 100G 1310nm PAM4 EML and 70/100/150/200mW CW DFB products for high-speed optical interconnect in AI applications.
MTC said it has established a complete industrial chain from optical chips and optical devices to optical modules, and has achieved collaborative research, development and manufacturing across multiple stages of the chain.
Why this event matters
The event has a measured impact on 2 industrys. The strongest current signal is positive for Semiconductor Value Chain, with intensity 50/100 and 60% confidence over a medium term horizon.
Semiconductor Value Chain
- Direction
- positive
- Intensity
- 50
- Confidence
- 60%
- Horizon
- Medium term
Network Equipment
- Direction
- positive
- Intensity
- 45
- Confidence
- 55%
- Horizon
- Medium term
Impact figures are analytical estimates that combine direction, intensity, confidence and event importance. They are not investment advice.