Nvidia Launches World's First 200G/Lane CPO Ethernet Switch Into Full Mass Production

Nvidia has announced that its Spectrum-X Ethernet silicon photonics switch has entered full mass production. Built on the new Spectrum-6 switching chip and employing co-packaged optics technology, the switch is described by Nvidia as the world's first 200G/lane CPO Ethernet switch system to reach mass production. Compared with existing solutions, the switch cuts the number of lasers by four times, reduces power consumption by five times, and improves mean time between failures by ten times. Foxconn handles system assembly, Lumentum manufactures the laser chips, SPIL undertakes wafer-level and chip-level packaging and testing, TFC is responsible for laser module sub-assembly, and TSMC provides advanced silicon photonics process manufacturing.

Spectrum-X Ethernet Photonics integrates CPO directly with the ASIC, raising bandwidth per switch chip to 102.4Tb/s, double the 51.2Tb/s of the Blackwell-generation Spectrum-4. Compared with network architectures based on traditional pluggable transceivers, the combination of integrated silicon photonics and external laser arrays reduces component count and failure points, cutting optical loss from approximately 22dB to about 4dB and improving signal integrity by 64 times. CoreWeave, Lambda and Oracle are the first adopters. Production ran from May to July 2026, and the product has now entered full mass production.

Recently, several optical chip companies have announced capacity expansion, private placement or new project investment plans, including Yuanjie Technology, Shijia Photonics and Focuslight Technologies. The announcements indicate that optical communications capacity expansion has moved from the planning stage into substantive capital expenditure. With the development of AI computing infrastructure, data center interconnection, silicon photonics and CPO applications, optical interconnect technology continues to evolve.