Samsung, Broadcom Expand Cooperation in Memory, Chip Manufacturing, Advanced Packaging

Broadcom is one of the world's leading custom AI chip designers. Securing a long-term production commitment from Broadcom helps improve utilization of Samsung's advanced manufacturing facilities, thereby gaining a more advantageous position in the AI chip supply competition.

Samsung said in a statement that the expanded cooperation reflects the company's commitment to supporting customer needs in increasingly diverse AI and high-performance computing applications through end-to-end semiconductor technology. As global technology companies increasingly develop their own custom AI accelerators rather than relying solely on general-purpose graphics processing units, demand for specialized chip design and manufacturing partnerships continues to grow.

The memorandum of understanding signed by the two companies highlights Samsung's move to strengthen its position in the AI semiconductor sector by deepening its long-term cooperation with Broadcom amid rising demand for custom AI processors. The five-year cooperation will combine Broadcom's expertise in application-specific integrated circuit design with Samsung's manufacturing capabilities. Samsung said Broadcom's next-generation communication chips for high-speed data transmission will be manufactured using Samsung's sub-2nm process technology, and the two sides will also collaborate on developing next-generation high-bandwidth memory products.

This cooperation helps strengthen Samsung's foundry business, as the company seeks to narrow the gap with industry leader TSMC by attracting large technology clients. Last month, Samsung co-chief executive and chip division head Jeon Young-hyun said he discussed next-generation foundry cooperation with Nvidia chief executive Jensen Huang, including future HBM4E and HBM5 memory products. Last year, Samsung won a contract worth 16.5 billion US dollars to manufacture logic chips for electric vehicle maker Tesla.