TCL Tech Plans 12-Layer Glass Substrate Sample in H2 2026, Pilot Line This Year
TCL Technology said it plans to introduce a 12-layer glass substrate sample in the second half of 2026 and aims to start a pilot production line within this year. The company noted that mainstream glass-based advanced packaging typically requires 20 layers for high-performance chips, but its current sample will have fewer layers due to external resource constraints.
TCL Technology said during a recent institutional survey that mainstream glass-based advanced packaging typically requires 20 layers when applied to high-computing-power and high-performance chip packaging. The company is currently leveraging external resources to validate the technical route and prepare complete samples.
Due to limitations in external resources, the glass substrate sample planned for launch in the second half of 2026 will have about 12 layers, falling short of the 20-layer standard.