Xiaomi Unveils Xuanjie O3 Chip Souvenir, 13.5 Billion RMB Invested in Four Years

Xiaomi recently displayed a souvenir of its Xuanjie O3 chip, featuring the chip embedded in an aluminum plate with a signature from Lei Jun. The souvenir was included in the invitation gift box for the Xiaomi 18 Fold launch event. In 2025, Xiaomi released a similar souvenir with the Xuanjie O1, which was not sold publicly but given in limited quantities to media, employees, and select users.

In 2025, Lei Jun attached a letter when giving souvenirs to employees, stating that the Xuanjie O1 was Xiaomi's first high-end flagship SoC and the first self-developed SoC on the mainland using a 3nm advanced process. After more than four years of development, Xiaomi had positioned itself among the global leaders in SoC research. Xiaomi's self-developed chip strategy spans a decade, with the large-chip SoC effort officially restarted in 2021. Over four years, the company invested RMB 13.5 billion, culminating in the Xuanjie O1.

In 2026, Xiaomi launched the iterative product Xuanjie O3, which retains the 3nm process but delivers significant performance gains. The CPU adopts a ten-core all-big-core design, featuring C1-Ultra, C1-Premium, and C1-Pro cores with a maximum frequency of 4.35GHz. Its multi-core score exceeded 15,000 for the first time, a 60% improvement over the previous generation. The GPU debuts a 16-core G2-Ultra NX graphics processor, boosting performance by 85% while reducing power consumption by 64%.

The Xuanjie O3 is the world's first mobile processor to support LPDDR6, with bandwidth reaching 113.8GB/s, a 48% increase over the Xuanjie O1. The chip integrates 60MB of on-chip cache, including 12MB of L2, 16MB of L3, plus dedicated caches for the GPU and NPU, and a 16MB system-level shared cache. The NPU architecture has been fully redesigned for Xiaomi's MiMo on-device large model, delivering 200 TOPS of tensor compute power and 3.13 TFLOPS of vector compute power, with on-device AI performance improving by 45%.