Yuzu Network-Backed Dijiang Technology Launches Advanced Packaging Project in Shanghai

On September 16, 2026, the launch ceremony for Dijiang Technology's advanced packaging project, co-initiated by Yuzu Network (002174), was held at the World Reception Hall in Shanghai. Yuzu Network Chairman Wan Zheng and Dijiang Technology founder Cai Menglin jointly unveiled the project. The project will subsequently invest in building large-scale production lines in phases, creating a full-category 2.5D/3D advanced packaging process platform to provide one-stop mass-production foundry services for high-computing-power chip customers in AI, memory, and other sectors.

Dijiang Technology is an industrialization platform company focused on 2.5D/3D advanced packaging. Its process routes and equipment selections have been verified through multiple mass-production products, and its core team is composed of advanced packaging experts with mass-production experience in high-end AI chips. Yuzu Network will provide support in industrial resource matching and investment and financing cooperation.