Zhenbao Tech unit to invest RMB520 million in semiconductor parts base, using RMB250 million of over-raised

Zhenbao Technology announced on the evening of August 7, 2026 that its wholly owned subsidiary, Wuhan Zhenbao Semiconductor Technology Co. , Ltd. , plans to invest RMB520 million to build a semiconductor parts R&D and production base project, of which RMB250 million is planned to come from over-raised funds. The construction period is three years. The project will be located in Wuhan East Lake High-tech Development Zone, with main construction covering silicon carbide raw materials and parts, high-purity silicon precision parts, and aluminum nitride ceramic materials and parts. The company has mastered preparation technologies for large-diameter single-crystal silicon rods, polycrystalline silicon rods, chemical vapor deposition high-purity silicon carbide ultra-thick materials, and ceramic granulation powders, as well as high-precision machining of hard and brittle materials such as silicon, quartz, and silicon carbide, and high-density coating preparation technologies.

The company completed its initial public offering and listing on the STAR Market in June 2026, with net proceeds of approximately RMB1.605 billion, including about RMB407 million of over-raised funds. The investment proposal has been approved by the company's board of directors and still needs to be submitted to the shareholders' meeting for approval.

The company's existing production base has reached its designed capacity limit and has been running at full capacity for a long time, with a lengthened order scheduling cycle. The project is located in Wuhan, where a cluster of wafer manufacturing, equipment integration, and supporting materials industries has formed, providing industrial synergy and locational advantages. The company's products have been applied in batch to advanced logic processes, 3D NAND flash memory, and DRAM advanced process memory chip manufacturing.