Fujian Unveils 15th Five-Year Plan for Emerging Industries, Focusing on AI Chips and Advanced Semiconductors

The Fujian Provincial People's Government has recently issued the "Fujian Province 15th Five-Year Plan for the Development of Emerging Industries and Future Industries," designating Xiamen, Quanzhou, Fuzhou, and Putian as key areas for cultivating capabilities in chip design, specialty process chip manufacturing, packaging and testing, as well as components and equipment support. The plan calls for the development of high-performance AI system-on-chips, autonomous driving chips, and industrial control chips, while steadily expanding manufacturing capacity for 12-inch wafers, power semiconductors, and analog chips, to promote large-scale and differentiated industry development. To address chip demand in computing power, storage, display, and radio frequency, the plan aims to build a packaging and testing industry system covering both advanced and traditional packaging, while enhancing supporting capabilities for packaging substrates and developing equipment.

The plan also proposes establishing Xiamen as the core, in coordination with Quanzhou and Longyan, to build a full-chain compound semiconductor industry, with an emphasis on improving the mass production capacity of silicon carbide and gallium nitride substrates and epitaxial wafers, as well as increasing the output and yield of high-quality gallium nitride single-crystal substrates. Additionally, it plans to introduce core equipment enterprises, cultivate production equipment such as single-crystal growth furnaces, specialty etching machines, and ion implanters, and develop local supporting supplies for key consumables including high-purity silicon carbide powder and graphite carbon felt. The plan requires accelerating the development of automotive-grade high-power devices and developing RF chips and microwave components for 5G/6G macro base stations and low-orbit satellite communications, to complete the relevant technology and product layout.