Glass-Based Advanced Packaging Draws Display Makers; TCL CSOT Targets 2026 Sample Showcase
Glass-based advanced packaging is becoming a new battleground for semiconductor display makers as AI chips outpace traditional organic substrates. TCL CSOT CEO Zhao Jun said at Shanghai ChinaJoy that the company has formed a team to verify key glass-based packaging processes, aiming to show samples and build a pilot line development platform in the second half of 2026. BOE invested RMB 993 million in 2024 in a glass-based packaging carrier test line, and Tianma has built the MPG multi-project glass substrate technology platform. Large-scale commercialization remains uncertain.
Glass-based advanced packaging is emerging as a new direction for semiconductor display makers. As AI chips evolve toward larger dimensions, higher computing power, and higher-density interconnect, traditional organic substrates are gradually approaching performance limits. Glass substrates, whose thermal expansion coefficient is closer to that of silicon chips, offer higher flatness, lower dielectric loss, and stronger insulation, drawing industry attention. TCL CSOT, BOE, and Tianma have all entered the field, with cross-border paths centered on core process synergies.
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