Google Pixel 11 Series Launches with TSMC 3nm Tensor G6, Cutting CPU Power 20%, Boosting TPU 50%
Google has officially launched and opened pre-orders for its Pixel 11 series, with hardware vice president Peng Yujun confirming that all models run on the Tensor G6 chip built on TSMC's 3nm N3P process, the same node used by the previous Tensor G5. The chip's revised CPU configuration, featuring one fewer core and an architectural upgrade, reduces power consumption by up to 20%, while TPU performance rises 50% for stronger on-device AI. A new Titan M3 security chip protects user data and system integrity.
Google's Pixel 11 series smartphones have been officially released and opened for pre-order, with the manufacturing process of the new Tensor G6 chip now confirmed. Google hardware vice president Peng Yujun confirmed that all Pixel 11 models employ the Tensor G6 chip built on a 3nm process, continuing the TSMC 3nm (N3P) node used by the previous Tensor G5 generation, rather than the TSMC 2nm node some had speculated.
In terms of chip architecture, the Tensor G6 reconfigures the CPU core setup, removing one core while upgrading the architecture to achieve up to a 20% reduction in power consumption, enhancing battery endurance. The new TPU (Tensor Processing Unit) delivers 50% better performance to strengthen on-device AI compute, and comes with a new Titan M3 security chip designed to safeguard user data privacy and system security.
Why this event matters
The event has a measured impact on 2 industrys. The strongest current signal is positive for Smartphones, with intensity 30/100 and 70% confidence over a medium term horizon.
Smartphones
- Direction
- positive
- Intensity
- 30
- Confidence
- 70%
- Horizon
- Medium term
Semiconductor Value Chain
- Direction
- neutral
- Intensity
- 25
- Confidence
- 60%
- Horizon
- Short term
Impact figures are analytical estimates that combine direction, intensity, confidence and event importance. They are not investment advice.